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  • Extruded heatsink / for BGA

BDN series

Article: 00059216

Extruded heatsink / for BGA

Pre-applied adhesive - just peel off the release
liner and press onto the component
Reduces assembly costs; no more
messy adhesives or greases required
Excellent mechanical bond
Thermally optimized pin fin
Omnidirectional
Adhesive shear strength at 100°C is
36psi (a one inch square heat sink would
require a 36lb. force to remove heat sink)
Applicable for BGA, PGA, PLCC,
and QFP packages

Specifications

  • Options: extruded, for BGA

Other items

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