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microDICE

Article: 00072712

Laser micro-machining machine

Cost, quality, and throughput are major factors of success for SiC based devices in the semiconductor industry. 3D-Micromac answers this challenge with its brand-new microDICE? system.

The revolutionary, high-performance microDICE? laser dicing system brings TLS-Dicing? technology (Thermal-Laser-Separation) to semiconductor?s back-end.

The microDICE? separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput.

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