TAS300

Article: 00082494

Wafer materials handling system

TDK is proud to introduce it's Contamination Free, Clean Technology!

Our new TAS300 FOUP Loadport is matching the latest requirements of the Semiconductor Industry.

It is offers High Reliability and is Particle Contamination Free!
Advantages:
Compatibility of pod
Cushion mechanism that allows secure opening and closing of FOUP of each company
Entegris
Shin-Etsu Polymer
Kakizaki Mfg.
Dainichi Shoji
Asyst
Particle free based on the total clean technology

Specifications

  • Product applications: wafer

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