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max. 18 GHz, 0.05 in, 7 - 17 mm | SEARAY? series

Article: 00009536

Backplane connector / rectangular / press-fit / high-density

Samtec?s SEARAY? products are the industry?s largest offering of high speed, high density open pin field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.
SEARAY? Open Pin Field Arrays feature a .050" x .050" (1,27 mm x 1,27 mm) pitch grid for maximum grounding and routing flexibility. This system is available in stack heights from 7 mm to 40 mm with up to 500 Edge Rate® contacts. Vertical or right angle arrays (SEAM/SEAF Series) and a mating high speed cable assembly (SEAC Series) are available as 50? or 100? solutions. High retention press fit tails (SEAMP/SEAFP Series) and an 85? tuned interconnect (SEAMI Series) offer greater system flexibility. Elevated board stacking up to 40 mm is achieved by Samtec?s high speed, high density riser (SEAR Series).
FEATURES

Maximum routing and grounding flexibility
Lower insertion/extraction forces vs. typical array products
Performance up to 18 GHz/pair
Up to 500 I/Os in open pin field design
1.27 mm (.050") pitch and space saving 0.80 mm pitch
Rugged Edge Rate® contact system
Can be "zippered" during mating/unmating
Solder charge terminations for ease of processing
Meets Extended Life Product? (E.L.P.?) standards
7 - 17 mm stack heights
Vertical, right angle, press fit
85? systems

Specifications

  • Type: backplane
  • Shape: rectangular
  • Connection type: press-fit
  • Electrical characteristics: high-density, grounding
  • Other characteristics: rugged, high-speed

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