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Forging presses, Compression presses...

Avure Technologies

  • Lamination press / for multi-layer electronic components / isostatic

ILP

Article: 00054249

Lamination press / for multi-layer electronic components / isostatic

Avure has developed a series of high pressure Isostatic Laminating Presses (ILP) for the cost-effective lamination of a variety of electronic components including MLCCs, LTCCs, hybrid chips, ferrites, Base Metal Element packages, multi-layer PZTs, medical electronics and implant devices, electronic filters, varistors, Bluetooth components, fuel cells, and other multi-layer modules.

ILP Can Produce Huge Gains in Productivity

Isostatic Laminating Presses offer throughput rates of up to 20 times those of traditional uniaxial heated platen presses. Large, fully accessible work baskets hold numerous vacuum-bagged parts in horizontal stacks or vertical rows, and can accommodate packages up to 20 in length. Multiple packages of varying sizes can be laminated in a single 3-10 minute cycle.

ILP Provides Both Speed and Quality

Even with its overwhelming productivity advantages, the Avure isostatic laminator produces finished modules with virtually flawless quality:

Evenly distributed lamination pressure prevents package distortion
Shrinkage is precisely controlled, and part-to-part variation is eliminated
Excellent heat transfer to all areas of the part ensures uniform lamination
No rounding of edges or camber
No edge trimming
No in-cycle part rotation
Rejected parts and scrap costs are significantly reduced

Specifications

  • Process type: lamination
  • Applications: for multi-layer electronic components
  • Other characteristics: isostatic

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