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Integrated Circuits Flash Memory

Toshiba America Electronics Components

  • NAND memory chip

Article: 00069525

NAND memory chip

Advanced functions such as those that allow the playing and storing of still images, movies, and music data or the playing of games are increasingly being incorporated into mobile devices such as cell phones. To this end, there is a need to process large amounts of data faster. At the same time, there is increasing need for a multi-layer, multi-chip package (MCP) because these functions must be mounted in a limited space in a package


Features

Toshiba's MCP memory integrates large-capacity NAND flash memory (NAND), an e?MMC? controller and low-power DDR2 memory in a single package.
Assembled using state-of-the-art 3D chip-stacking technology, the MCP memory is available in a small, thin MCP package.
The integrated e?MMC? controller allows fast read and write access to NAND.
Toshiba's MCP memory also incorporates low-power, high-speed LPDDR2 memory and helps improve the performance and reduce the power consumption of mobile devices such as smartphones.

Specifications

  • Type: NAND

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