Implement Industry Ideas
  • Laser cutting machine / CNC

IX-210

Article: 00072772

Laser cutting machine / CNC

IPG Microsystems IX-210 solid-state laser machining system delivers high-speed wafer singulation with low cost, 20-30 times less than dicing saws or diamond scribes. With its extremely high throughput and process automation, the system pays for itself in weeks rather than years. The revolutionary IX-210 employs proprietary technology lasers, optics, motion control and process automation, providing unparalleled performance.

Main Features:
High Speed Wafer Singulation
300 mm/sec Scribe Rate for GaAs
Narrow Cuts - Down to 2.5 microns

Advanced Applications:
Scribing and Dicing of LED and Semiconductor Wafers
Metal Dicing
Controlled Taper Hole Drilling for Probe Cards

Specifications

  • Technology: laser
  • Control type: CNC

Other items

In this category | In this category, (IPG Photonics Corporation)

Leave request for price calculation right now, we will send you best prices.