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Laser cutting, Laser machining

IPG Photonics Corporation

  • Laser micro-machining machine

IX-100-C

Article: 00072771

Laser micro-machining machine

IPG Microsystems IX-100-C Micromachining System offers the researcher a powerful workstation which can be configured with a Galvo scanning processor and can be easily reconfigured for stationary beam, high stability micromachining applications in a flexible Class IV laser system. The system offers full flexibility for the small lab or research group seeking a single workstation to accommodate a variety of laser types and processing techniques. IPG Microsystems industry leading Microtech camera system enables use with standard galvanometers for scanning processes. A manual reconfiguration permits removal of the galvo for stationary fixed beam delivery, for more demanding micro machining and imaging applications. Microsystems IX-210 solid-state laser machining system delivers high-speed wafer singulation with low cost, 20-30 times less than dicing saws or diamond scribes. With its extremely high throughput and process automation, the system pays for itself in weeks rather than years. The revolutionary IX-210 employs proprietary technology - lasers, optics, motion control and process automation, providing unparalleled performance.

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