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Ovens

Yield Engineering Systems

  • Annealing oven / compact / electric / vacuum

VertaVac

Article: 00105168

Annealing oven / compact / electric / vacuum

The YES-VertaVac series of automated high vacuum ovens is designed for today?s most demanding MEMS and semiconductor process applications. These tools are designed to ensure moisture and hydrogen removal using high vacuum (10-5) and high temperature (up to 450°C). Our patented nitrogen purge precedes process ramp and creates a successful procedure for improved MEMS lifetime and performance.

Nitrogen purge also results in a low oxygen environment which allows for proper copper annealing or aluminum annealing.

The tool incorporates the laminar flow technology of the YES-PB HV Series. It accommodates 200 and 300mm wafers with one or two load ports and a wafer handling robot inside an integrated Class 1 minienvironment. Up to 50 wafers are loaded into a stainless steel cassette-type rack on the oven chamber door and, when loading is complete, lifted up into the vacuum chamber.

Specifications

  • Function: annealing
  • Configuration: compact
  • Heat source: electric
  • Atmosphere: vacuum
  • Other characteristics: stainless steel
  • Applications: for microelectronics industry
  • Maximum temperature: Min.: 100 °C (212 °F)

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