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Portable Saws

Logitech Limited

  • Abrasive saw / wire / bench-top / for sample preparation

AWS

Article: 00112002

Abrasive saw / wire / bench-top / for sample preparation

The AWS allows fragile or difficult materials to be cut or wafered without sample damage. The saw uses fine lapping and cutting technology to perform cuts with minimal material loss and minimal sample damage.

The variable wire speed and cutting load on this saw enables it to be used for a wide range of materials including expensive materials, such as Cadmium Zinc Telluride or YAG laser rods.

This compact, bench-top wire saw can slice samples up to 100mm (4") in diameter with a maximum boule/sample length of 100mm (4").

Specifications

  • Type: abrasive, wire
  • Other characteristics: compact, bench-top
  • Applications: for sample preparation, cutting

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