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Printed Circuit Boards

Bergquist Company

  • Printed circuit board / thermally-conductive substrate
  • Printed circuit board / thermally-conductive substrate
  • Printed circuit board / thermally-conductive substrate

T-Clad

Article: 00114715

Printed circuit board / thermally-conductive substrate

Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed wiring boards (PWB's). These substrates are more mechanically robust than thick-film ceramics and direct bond copper constructions that are often used in these applications.

Thermal Clad is a cost-effective solution which can eliminate components, allow for simplified designs, smaller devices and an overall less complicated production processes. Additional benefits of Thermal Clad include lower operating temperatures, longer component life and increased durability.

Specifications

  • Options: thermally-conductive substrate

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